Model:IS200AEPAH1BMF-P / IS210BPPCH1AD

Type:I/O Pack Processor Board

Brand:GE

Technology:Advanced Digital Signal Processing (DSP)

Input Capacity:Flexible, customizable based on application requirements

Output Capacity:Up to 16 channels, configurable

Communication Interface:RS-485, CANbus, Ethernet

Power Supply:24VDC

Operating Temperature:-20°C to +60°C

Storage Temperature:-40°C to +70°C

Dimensions:168mm x 104mm x 33mm

Weight:Approx. 0.5kg

    The GE IS200AEPAH1BMF-P I/O Pack Processor Board is engineered to handle the most demanding industrial applications with its robust design and high-speed processing capabilities. This board is part of the IS210BPPCH1AD series, known for its reliability and efficiency in managing critical control systems.

    Featuring a compact 3U CompactPCI form factor, it seamlessly integrates into existing industrial automation systems, offering a versatile solution for various industries including manufacturing, energy, and process control.

    With support for RS-232, RS-485, and Ethernet interfaces, this board ensures seamless communication between devices, enhancing operational efficiency and reducing integration time.

    Equipped with up to 2 GB DDR3L memory, it can store large datasets and perform complex calculations swiftly, making it ideal for real-time monitoring and control applications.

    Operated within a wide temperature range from -40°C to 85°C, this board is designed to withstand harsh industrial conditions, ensuring continuous operation in extreme environments.